Semiconductors & Semiconductor Equipment

Lam Research’s advanced etch & defect‑management tech keeps 3 nm/2.5 nm fabs high‑yield, high‑throughput while boosting AI, 5G and IoT chips.

Broadcom’s March 4 earnings reveal a surge in AI‑enabled telecom and 2‑nm chip revenue, highlighting its shift from component supplier to integrated infrastructure leader.

Marvell’s upcoming Q4 earnings reveal AI‑powered data‑center tech that doubles bandwidth, cuts power use, and promises edge‑AI, while supply‑chain and security risks loom.

Credo Technology Group raises Q3 revenue outlook, highlights ZeroFlap cables, optical DSPs and a new AI partnership, amid supply‑chain risks and competitive pressure.

Broadcom’s 2‑nm chips and VMware‑powered Telco Cloud platform power AI‑centric data‑center growth, boosting performance while cutting energy and costs.

Qualcomm’s strategy for 4‑nm and 3‑nm chips tackles supply‑chain bottlenecks, yield challenges, and memory price swings—offering investors insight into how the mobile‑chip giant navigates tightening semiconductor conditions.

Marvell’s AI‑centric Q4 2026 earnings preview highlights a high‑speed serial link that doubles throughput, 15‑20% power savings, and secure networking & NVMe‑oF solutions, positioning it to drive future revenue growth.

Broadcom’s 2‑nm, 3.5‑D AI SoC launch could drive $15 bn by 2028, but rising CAPEX, export limits and fierce competition pose key risks to the 2026 Q1 outlook.

Qualcomm’s share price climbs as it tackles supply‑chain issues, invests in 3 nm tech, 5G, AI and hires an Intel veteran to boost manufacturing.

Broadcom’s first 2‑nm, 3.5‑D AI SoC delivers 30% higher bandwidth and 20% energy savings, poised to hit a million units by 2027 and reshape hybrid data‑center AI.