BE SEMICONDUCTOR INDUSTRIES

BE Semiconductor’s HBM hybrid‑bonding faces market slow‑roll, but new AI‑focused partnerships and a €60 m buy‑back plan hint at a path to growth.

BE Semiconductor joins Applied Materials’ EPIC Center, expanding advanced packaging from hybrid bonding to die‑on‑wafer, die‑on‑die, and thermo‑compression for faster AI & photonics deployment.